The spindle test point is very reliable

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CNC drilling and milling machines

The borehole diameters are getting smaller and smaller. Precise positioning and clean, fast drilling of the circuit boards are the main tasks.

Manufacturer: Ernst Lenz Maschinenbau GmbH
Type: 3 pieces DLG 615-1-AL
Year of construction: 2002, 2005, 2007
Technology:
  • Tool measurement by laser
  • Two separate spindles for special requirements
    Drilling spindle with air bearings for small bores, as well as spindle with ball bearings for milling and large bores
  • Speed ​​up to 200,000 rpm for drill diameters from 0.10mm
  • Linear motors for fast and precise movements
  • Max. 9 µm drilling position deviation
  • High-precision deep drilling through contact drilling
  • Position-corrected drilling / milling using a CCD camera


Brush machine

It is used to remove any fine burrs after drilling the circuit boards and to roughen the surface as a primer for the subsequent chemical processes.

Manufacturer: Höllmüller Maschinenbau GmbH
Type: HMS brush
Year of construction: 2004
Technology:
  • Oscillating rollers for an even surface
  • High-pressure cleaning rinse to wash out the last remains of any remaining drilling dust
  • Automatic brush infeed through panel thickness measurement

Photo plotter

The transfer of the layout data (circuit diagram, solder mask, position printing, etc.) to the circuit board takes place via a photographic process. The films required for this are laser-plotted in the clean room and under very constant climatic conditions.

Manufacturer: Orbotech Ltd.
Type: PP 9008-HS
Year of construction: 2006
Technology:
  • High-end photo plotter for the most precise conductor pattern templates
  • Structures from 1 mil (25.4 µm) can be displayed

  • Plotting capacity:> 15 films per hour
  • Fully automatic film creation from work preparation data (CAM)

  • Cut sheet laminator

    A UV-light sensitive electroplating and etching resist (lacquer film) is laminated to the Cu surface of the base material with heated rollers and constant pressure. Because of the high requirements for a bubble-free and warp-free application, only a system manufacturer who is a leader in the high-end area is trusted here.

    Manufacturer: Hakuto Europe GmbH
    Year of construction: 2001
    Type: Hakuto 1500B
    Technology:
    • Automatic cutting of the resist edges
    • Here, it depends on a bubble and warp-free processing

    Imagesetter

    The automatic exposure device exposes the areas of the galvanic resist or solder mask exposed by the films. The films are automatically aligned with the circuit boards by camera monitoring so that the drill holes are exactly in the center of the pad.

    Manufacturer: Olec corporation
    Type: AT30 Accutray
    Year of construction: 2003
    Technology:
    • Automatic registration via CCD camera for minimal misalignment between the drilling and conductor pattern
    • Variable up to 8 kW burner output
    • Structure widths of 75 µm are applied

    Electroplating Resist Developer

    After the circuit board has been exposed to light, the conductive pattern is fully developed, i.e. the electroplating resist is chemically removed again using soda (sodium carbonate) from the areas covered by the film and thus unexposed. The exposed copper can then be etched away in the subsequent process or additional copper can be electroplated, depending on the process and type of circuit board.

    Manufacturer: Otto Dilg GmbH
    Type: D 650-A
    Year of construction: 1997
    Technology:
    • Uniform spray pattern
    • Feed depending on the type of paint (0.5-3 m / min)
    • 100% flushing waste water-free thanks to the optimized flushing process.

    Etching machine

    The exposed copper between the conductor tracks, which are covered with the electroplating and etching resist, is etched away. The acidic process with hydrogen peroxide and hydrochloric acid is used for this. The highlight of the system is the process, patented by the manufacturer, not only to allow the used etching medium to flow off, but to suck it off again immediately with a vacuum. This means that the finest conductor tracks and spaces can be applied to the circuit boards.

    Manufacturer: Pill
    Type: Vacuum Etching Machine Export 650
    Year of construction: 2003
    Technology:
    • Reliably reproducible etching results through the use of a patented vacuum etching technology
    • Fully automatic process bath monitoring and metering of HCL and H2O2.
    • 100% flushing waste water-free thanks to the optimized flushing process
    • Fully automatic nozzle and pressure monitoring to detect blocked nozzles immediately

    Resist stripping line

    The galvanic and etching resist, which is no longer required for the further process steps, is removed again with this system. It is important to ensure that the copper surface is completely removed without oxidizing.

    Manufacturer: Fa. Höllmüller Maschinenbau GmbH
    Type: HMS stripping system
    Year of construction: 2004
    Technology:
    • PLC computer control for various temperature profiles
    • Automatic metering of fresh developer solution via conductivity measurement in the process bath
    • 4-way rinsing cascade for optional and water-saving rinsing process
    • Guarantees very good drying results even with a high aspect ratio (ratio of drilling diameter / drilling depth)

    Multilayer press

    Inner layers, prepregs and copper foils are pressed into a multilayer. In the case of an SBU (Sequential Build Up) multilayer, this and many other processes take place several times.

    HML multilayer presses
    Type: HML MP-2 VK
    Year of construction: 2004
    Technology:
    • 2 floors
    • Up to 12 standard multilayers can be pressed in each of the 2 floors
    • Max. Pressure 500 kN
    • Max. Press temperature 310 ° Celsius
    • PLC computer control for various temperature profiles
    • Vacuum press chamber

    Solder mask developer

    Unexposed areas of the solder mask are exposed (developed). These are the places where the customer can solder later.

    Manufacturer: Pill
    Type: Export 650
    Year of construction: 2001
    Technology:
    • Special nozzles ensure optimal distribution of the developer solution on the circuit board
    • Automatic metering of fresh developer solution via conductivity measurement in the process bath
    • 100% flushing wastewater-free thanks to the optimized flushing process
    • High performance drying module

    Solder mask dryer

    The solder mask dryer can pre-dry or final cure the respective side for the solder mask exposure with the help of infrared heaters, depending on the program setting. Different panel thicknesses and materials are taken into account.

    Manufacturer: Beltron
    Type: Thermal dryer
    Year of construction: 2002
    Technology:
    • PLC computer control allows different temperature profiles for different materials
    • A pre-crosslinking of the solder mask before exposure as well as a final hardening of the solder mask after development is possible through program control.

    HAL (Hot Air Leveling)

    Hot air coating with tin. As a pretreatment for good wetting, the circuit board is immersed in a flux agent. The circuit board is then dipped into liquid tin for a few seconds and the excess is blown off with high pressure when it is pulled out. Maintaining a layer thickness distribution that is as constant as possible is a fundamental problem owed to physics. That is why a proven system with excellent blow-off properties is used here.

    Manufacturer: Penta GmbH
    Type: Penta 600
    Year of construction: 1996
    Technology:
    • PLC control with different programs for different types of printed circuit boards
    • Soldering and blow-off temperature can be selected up to 320º Celsius

    AOI (Automatic Optical Inspection)

    The circuit board is optically scanned and compared with the CAM data (manufacturing data). The finest deviations from the customer's data specifications must be reliably detected.

    Manufacturer: Camtek
    Type: Orion 828
    Year of construction: 2005
    Technology:
    • Deviation detection up to 5 µm
    • A wide variety of materials and surfaces can be tested: photoresist on copper, inner and outer layers of rigid and flexible printed circuit boards, among others.

    Electrical test (E-test)

    Net lists are generated from the customer data and then transferred to test points. An electrical measurement of all conductor tracks and vias of the circuit boards is now carried out. Possible interruptions and short circuits can be recognized reliably and quickly.


    Manufacturer: atg test systems GmbH & Co. KG
    Type: 2 pieces of electrical finger tester ATG-A3 and ATG-A5
    Year of construction: 2001, 2006
    Technology:
    • Simultaneous measurement with 8 test heads (4th
      per page)
    • Digital signal processor for each probe
      direct evaluation of the position and measured values
    • Soft-touch test heads with 5g needle pressure
      for problem-free bonding
    • Automatic compensation of delay and
      Offset errors of the test item
    • High voltage measurement (500V), connection test,
      Isolation test, resistance test